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    FACILITIES

Our Facilities

Our growth is linked to the dramatic advancement of semiconductor devices and of the progress of the entire electronics industry, with 8,279 sq.m. in three locations and approximately 1,000 employees.

The Group is poised to take on a wider scope of manufacturing capability to eventually provide completely "burn-in" and tested semiconductor devices.

We are making good progress in broadening our capabilities and expanding our production facilities to meet market demands.

  OUR EQUIPMENT
 

Burn-In System

Auto Loader/Unloader

  • WEB 4800 for QFP package
  • MCE B420B for QFP package
  • FASTRACK
    TY3830/3900/3910 for QFP & BGA package
  • CHIPRIGHT 16LD/54LD for SOIC package

Auto Unloader

  • Excellon 28ld PLCC
  • Excellon 44ld PLCC
  • Excellon 52ld PLCC
  • Excellon 68ld PLCC
  • Excellon 54ld SOIC

Lead Scanner

  • RVSI Scanner
  • TI
    68ld PLCC / 52ld PLCC / 44ld PLCC
  • ICOS Scanner
  • IPT 16LD/54LD SOIC Scanner

Lead Conditioner

  • EverTech (QFP package)

Power Supply

  • Hewlett Packard
  • Power Ten
  • EMI (SCR, TCR)
  • Numeric-Lambda

Burn-In Board Tester

  • CROSS Tester - test up to 288 pins
  • TRIPLE-S Tester
    - test up to 144 pins

Burn-In Board Cleaning Machine

  • Ultrasonic

 

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